Esma AKCİ, BSc. Student

Metallurgical and Materials Engineering

Yıldız Technical University

 

akciesma@gmail.com

www.linkedin.com/in/esma-akci/

Electrophoresis Ceramic Coatings

Co-Supervisor: Yasin Bozkurt Yılmaz

Electrophoretic deposition (EPD) is a popular technique which uses in ceramic coating for complex shapes. EPD has been known since 1808 but this technique was first used practically in 1933 [1]. This process is known as electrodeposition, electrophoresis, and E-coating. It is also known as EPE in the enameling industry. Electrophoretic deposition is a colloidal process wherein bodies are coated directly from a stable colloid suspension by DC electric field [2]. It consists of two processes; electrophoresis and deposition [3]. In electrophoresis, charged powder particles migrate towards electrode under influence of dc electric field. In the deposition, the powder particles deposit on the dense mass electrode. The advantages of EPD method over other methods are; applicability to complex surfaces, short formation time, more simple equipment needed, cheaper cost of coating, versatility and easiness in thickness control [1,4]. The aim of this study is the electrophoretic coating of metallic surfaces with advanced ceramic-based materials. The process route of the EPD is as follows. Firstly, the batch is prepared, during preparing batch, considering the effects of mill additives and oxides on coating is an important parameter. Then, the particles are milled to gain the desired size (1-20 µm). After preparing suspension, the properties of suspension are tested. The substrate is dipped and the 2-50 Volts per inch voltage is applied to the electrodes. Due to the application of voltage, charged particles in the suspension move towards the electrode. After a certain time, the substrate is removed from the bath, dried, and then sintered at 800 °C-850 °C.

[1] L. Besra and M. Liu, “A review on fundamentals and applications of electrophoretic deposition (EPD),” Prog. Mater. Sci., vol. 52, no. 1, pp. 1–61, 2007.

[2] J. B. T. O. Van der Biest, A. R. Boccaccini, Ed., “Electrophoretic Deposition: Fundamentals and Applications,” 2002, p. 320.

[3] P. Sarkar and P. S. Nicholson, “Electrophoretic deposition (EPD): Mechanisms, kinetics, and application to ceramics,” Journal of the American Ceramic Society, vol. 79, no. 8. pp. 1987–2002, 1996.

[4] D. Vélez, J. Muñoz, and J. A. Diez, “Influence of Application Technology in the Structural Characteristics of Ceramic Coatings with Advanced Anticorrosive and Tribological Properties,” Adv. Sci. Technol., vol. 91, pp. 108–116, 2014.